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Split handheld fiber laser marking machine

Portable Handheld 30W Fiber Laser Marking Machine more easy moving and operating.It has wisely using for heavy product not easy moving objects, like steel shelf, tank, wheels, etc and some part of non-metal marking. Also can standard marking in workshop / home.
Online Flying CO2 Laser Marking Machine 30W 60W

High speed online flying CO2 laser marking machine for coding date on bottle. Suitable for cables, PE pipes, the it is especially suitable for automatic production line of date code or bar code. To achieve assembly line operations to improve production efficiency.
200W Coherent Large Size Dynamic Laser Marking Machine

The 200W Coherent 3D Dynamic CO2 Laser Marking Machine is specialized design for Denim / Paper Laser Marking Application, which is widely used in the jeans producing / Paper Card Cutting, and it is also the most popular model in the market.
Desktop CO2 Laser Marking Machine 30W 60W 100W

Co2 laser marking machine adopts imported CO2 RF laser generator and high speed galvo scanner system. With high quality optic devices, high stability laser generator,full automatic control system. The machine system working with high precision and fast speed, very stable performance,can work continuously for a long time and can be applied directly in large quantities of online processing lines.
Portable CO2 Laser Marking Machine

The main processing object is non-metal, widely used in food packaging, pharmaceutical packaging, architectural ceramics, clothing accessories, leather, fabric cutting, craft gifts, rubber products, electronic components packaging, shell nameplate and so on. Suitable for paper, wood, glass, leather and other materials.
5W online flying UV laser marking machine

UV laser marking machine use the wavelength of 355nm ultraviolet laser, which has very small focus spot and can greatly reduce the mechanical deformation and processing heat effect of the material.UV laser is mainly used for ultra-fine marking, especially suitable for food, pharmaceutical, microporespunching, face-mask, high-speed cutting of glass materials and the complex graphic cutting of silicon wafers.

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